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this is information on a product in full production. may 2012 doc id 018958 rev 3 1/17 17 STGIPN3H60A sllimm?-nano (small low-loss intelligent molded module) ipm, 3 a - 600 v 3-phase igbt inverter bridge datasheet ? production data features ipm 3 a, 600 v, 3-phase igbt inverter bridge including control ics for gate driving and freewheeling diodes optimized for low electromagnetic interference v ce(sat) negative temperature coefficient 3.3 v, 5 v, 15 v cmos/ttl input comparators with hysteresis and pull-down resistor undervoltage lockout internal bootstrap diode interlocking function optimized pinout for easy board layout applications 3-phase inverters for motor drives dish washers, refrigerator compressors, heating systems, air-conditioning fans, draining and recirculation pumps description this intelligent power module implements a compact, high-performance ac motor drive in a simple, rugged design. it is composed of six igbts with freewheeling diodes and three half- bridge hvics for gate driving, providing low electromagnetic interference (emi) characteristics with optimized switching speed. the package is optimized for thermal performance and compactness in built-in motor applications, or other low power applications where assembly space is limited. sllimm? is a trademark of stmicroelectronics. ndip-26l table 1. device summary order code marking package packaging STGIPN3H60A gipn3h60a ndip-26l tube www.st.com
contents STGIPN3H60A 2/17 doc id 018958 rev 3 contents 1 internal schematic diagram and pin configuration . . . . . . . . . . . . . . . . 3 2 electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.1 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.2 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.1 control part . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4 application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4.1 recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 5 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
STGIPN3H60A internal schematic diagram and pin configuration doc id 018958 rev 3 3/17 1 internal schematic diagram and pin configuration figure 1. internal schematic diagram gnd vcc hin lin vboot lvg out hvg gnd vcc hin lin vboot lvg out hvg gnd vcc hin lin vboot lvg out hvg lin u nc hin u v cc u nc lin v hin v v cc v nc nc nc lin w hin w v cc w nc gnd n w w, out w vboot w n v v, out v p vboot v n u u,out u vboot u pin 1 pin 16 pin 17 pin 26 am09917v1
internal schematic diagram and pin configuration STGIPN3H60A 4/17 doc id 018958 rev 3 table 2. pin description pin symbol description 1 gnd ground 2 nc not connected 3v cc w low voltage power supply w phase 4 hin w high side logic input for w phase 5 lin w low side logic input for w phase 6 nc not connected 7 nc not connected 8 nc not connected 9v cc v low voltage power supply v phase 10 hin v high side logic input for v phase 11 lin v low side logic input for v phase 12 nc not connected 13 v cc u low voltage power supply for u phase 14 hin u high side logic input for u phase 15 nc not connected 16 lin u low side logic input for u phase 17 v boot u bootstrap voltage for u phase 18 p positive dc input 19 u u phase output 20 n u negative dc input for u phase 21 v boot v bootstrap voltage for v phase 22 v v phase output 23 n v negative dc input for v phase 24 v boot w bootstrap voltage for w phase 25 w w phase output 26 n w negative dc input for w phase
STGIPN3H60A internal schematic diagram and pin configuration doc id 018958 rev 3 5/17 figure 2. pin layout (top view) (*) dummy pin internally connec ted to p (positive dc input).
electrical ratings STGIPN3H60A 6/17 doc id 018958 rev 3 2 electrical ratings 2.1 absolute maximum ratings table 3. inverter part symbol parameter value unit v ces each igbt collector emitter voltage (v in (1) = 0) 1. applied between hin i , lin i and gnd for i = u, v, w. 600 v i c (2) 2. calculated according to the iterative formula: each igbt continuous collector current at t c = 25 c 3a i cp (3) 3. pulse width limited by max junction temperature. each igbt pulsed collector current 18 a p tot each igbt total dissipation at t c = 25 c 8 w table 4. control part symbol parameter min. max. unit v out output voltage applied between out u , out v , out w - gnd v boot -18 v boot + 0.3 v v cc low voltage power supply - 0.3 18 v v boot bootstrap voltage - 0.3 618 v v in logic input voltage applied between hin i , lin i and gnd for i = u, v, w - 0.3 v cc + 0.3 v v out/ d t allowed output slew rate 50 v/ns table 5. total system symbol parameter value unit v iso isolation withstand voltage applied between each pin and heatsink plate (ac voltage, t = 60 sec.) 1000 v t j power chips operating junction temperature -40 to 150 c t c module case operating temperature -40 to 125 c i c t c () t jmax () t c ? r thj c ? v ce sat () max () t jmax () i c t c () , () ------------------------------------------------------------------------------------------------------- =
STGIPN3H60A electrical ratings doc id 018958 rev 3 7/17 2.2 thermal data table 6. thermal data symbol parameter value unit r thja thermal resistance junction-ambient 50 c/w
electrical characteristics STGIPN3H60A 8/17 doc id 018958 rev 3 3 electrical characteristics t j = 25 c unless otherwise specified. note: t on and t off include the propagation delay time of the internal drive. t c(on) and t c(off) are the switching time of igbt itself under the internally given gate driving condition. figure 3. switching time test circuit table 7. inverter part symbol parameter test conditions min. typ. max. unit v ce(sat) collector-emitter saturation voltage v cc = v boot = 15 v, v in (1) = 0 - 5 v, i c = 1 a - 2.15 2.6 v v cc = v boot = 15 v, v in (1) = 0 - 5 v, i c = 1 a, t j = 125 c -1.65 i ces collector-cut off current (v in (1) = 0 ?logic state?) v ce = 550 v, v cc = v boot = 15 v - 250 a v f diode forward voltage v in (1) = 0 ?logic state?, i c = 1 a - 1.7 v inductive load switching time and energy t on tu r n - o n t i m e v dd = 300 v, v cc = v boot = 15 v, v in (1) = 0 - 5 v, i c = 1 a (see figure 4 ) -275 ns t c(on) crossover time (on) - 90 t off turn-off time - 890 t c(off) crossover time (off) - 125 t rr reverse recovery time - 50 e on turn-on switching losses - 18 j e off turn-off switching losses - 13 1. applied between hin i , lin i and gnd for i = u, v, w (lin inputs are active-low).
STGIPN3H60A electrical characteristics doc id 018958 rev 3 9/17 figure 4. switching time definition 3.1 control part v ce i c i c v in t on t c(on) v in(on) 10% i c 90% i c 10% v ce ( a ) t u rn-on ( b ) t u rn-off t rr 100% i c 100% i c v in v ce t off t c(off) v in(off) 10% v ce 10% i c am0922 3 v1 table 8. low voltage power supply (v cc = 15 v unless otherwise specified) symbol parameter test conditions min. typ. max. unit v ccthon undervoltage turn-on threshold 9.1 9.6 10.1 v v ccthoff undervoltage turn-off threshold 7.9 8.3 8.8 v v cchys undervoltage hystereses 0.9 v i qccu undervoltage quiescent supply current v cc < 7.9 v 250 330 a i qcc quiescent current v cc = 15 v 350 450 a table 9. bootstrapped voltage (v cc = 15 v unless otherwise specified) symbol parameter test conditions min. typ. max. unit v boot_thon undervoltage turn-on threshold 8.5 9.5 10.5 v v boot_thoff undervoltage turn-off threshold 7.2 8.3 9.2 v v boothys undervoltage hystereses 0.9 v i qboot quiescent current 250 a r ds(on) bootstrap driver on-resistance v cc > 12.5 v 125
electrical characteristics STGIPN3H60A 10/17 doc id 018958 rev 3 table 10. logic inputs (v cc = 15 v unless otherwise specified) (1) 1. see figure 5: dead time and interlocking definition . symbol parameter test conditions min. typ. max. unit v il low level logic input voltage 1.1 v v ih high level logic input voltage 1.8 v i il low level logic input current v in (2) = 0 2. applied between hin i , lin i and gnd for i = u, v, w -1 a i ih high level logic input current v in (1) = 15 v 20 70 a dt dead time 320 ns figure 5. dead time and interlocking definition dt dt dt lin hin lvg hvg interlocking f u nction am0 3 794v1
STGIPN3H60A application information doc id 018958 rev 3 11/17 4 application information figure 6. typical application circuit
application information STGIPN3H60A 12/17 doc id 018958 rev 3 4.1 recommendations input signals hin, lin are active-high logic. a 500 k (typ.) pull-down resistor is built-in for each high side input. if an external rc filter is used for noise immunity, attention should be given to the variation of the input signal level. to prevent input signal oscillation, the wiring of each input should be as short as possible. by integrating an application-specific type hvic inside the module, direct coupling to the mcu terminals without an opto-coupler is possible. each capacitor should be located as close as possible to the pins of the ipm. low inductance shunt resistors should be used for phase leg current sensing. electrolytic bus capacitors should be mounted as close to the module bus terminals as possible. additional high frequency ceramic capacitors mounted close to the module pins will further improve performance. note: for further details refer to an4043. table 11. recommended operating conditions symbol parameter test conditions min. typ. max. unit v pn supply voltage applied between p-nu, nv, nw 300 500 v v cc control supply voltage applied between v cc - gnd 12 15 17 v v bs high side bias voltage applied between v booti - out i for i = u, v, w 11.5 17 v t dead blanking time to prevent arm-short for each input signal 1.5 s f pwm pwm input signal -40c < t c < 100c -40c < t j < 125c 25 khz t c case operation temperature 100 c
STGIPN3H60A package mechanical data doc id 018958 rev 3 13/17 5 package mechanical data in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com. ecopack is an st trademark. table 12. ndip-26l mechanical data dim. mm. min. typ. max. a 4.40 a1 0.80 1.00 1.20 a2 3.00 3.10 3.20 a3 1.70 1.80 1.90 a4 5.70 5.90 6.10 b 0.53 0.72 b1 0.52 0.60 0.68 b2 0.83 1.02 b3 0.82 0.90 0.98 c 0.46 0.59 c1 0.45 0.50 0.55 d 29.05 29.15 29.25 d1 0.50 d2 0.35 d3 29.55 e 12.35 12.45 12.55 e 1.70 1.80 1.90 e1 2.40 2.50 2.60 eb1 16.10 16.40 16.70 eb2 21.18 21.48 21.78 l 1.24 1.39 1.54
package mechanical data STGIPN3H60A 14/17 doc id 018958 rev 3 figure 7. ndip-26l package dimensions b1,b3 b,b2 c c1 d e eb1 eb2 e b d1 a3 e1 d2 a1 a4 l a a2 b2 d3 0.075 0.075 8278949_a
STGIPN3H60A package mechanical data doc id 018958 rev 3 15/17 figure 8. ndip-26l tube dimensions (dimensions are in mm.) note: base quantity 17 pcs, bulk quantity 476 pcs. antistatic s 03 pvc am10474v1 8313150_a
revision history STGIPN3H60A 16/17 doc id 018958 rev 3 6 revision history table 13. document revision history date revision changes 23-jun-2011 1 initial release. 09-jan-2012 2 document status promoted from preliminary data to datasheet. added figure 8 on page 15 . 02-may-2012 3 modified: min. and max. value table 4 on page 6 . added: table 11 on page 12 .
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